In the trend of increasingly thinner and more integrated modern electronic devices, miniaturization and functional integration of internal structural components have become key challenges.
The optimization of the surface treatment process for stainless steel sieve plates requires selecting the appropriate technical approach based on specific working conditions.
304 stainless steel small gaskets are widely favored for their excellent corrosion resistance, non-magnetic properties, and good machinability. However, their fatigue resistance is questionable under harsh conditions such as frequent disassembly and assem
In the precision world of surface mount technology (SMT), solder paste printing is the first critical step determining the overall quality of a circuit board assembly.
As a core consumable material, stainless steel sieve plate endures the impact, friction, and corrosion of particulate materials over extended periods. Its service life directly impacts production efficiency and maintenance costs.
In highly precise manufacturing fields such as consumer electronics, wearable devices, automotive modules, and flexible printed circuit (FPC) integration, rapid positioning, reliable fixation, and non-destructive assembly of components have become crucial