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How does PCB patch stainless steel mesh quantify the improvement effect of nano-coating technology?

Publish Time: 2026-02-19
In SMT surface mount technology, PCB patch stainless steel mesh is a core tool for solder paste printing, and its performance directly determines soldering quality and production efficiency. The aperture precision, surface characteristics, and durability of the stainless steel mesh affect the filling, release, and transfer effects of solder paste. Traditional stainless steel mesh faces problems such as solder paste adhesion, aperture clogging, and wear deformation during long-term use, leading to decreased printing quality and frequent downtime for cleaning. The introduction of surface nano-coating technology provides an innovative solution to this problem, demonstrating significant quantitative effects in improving release rate and extending print life.

1. Principle of Nano-Coating Technology: Fundamental Change in Surface Properties

Nano-coating involves depositing a functional thin film with a thickness of only tens to hundreds of nanometers on the surface of the stainless steel mesh. Common materials include diamond-like carbon, fluorocarbons, and ceramic nanoparticles. The coating is formed through chemical vapor deposition or physical vapor deposition processes, forming a strong bond with the substrate. Its core mechanism lies in altering surface energy characteristics, transforming the high surface energy of the stainless steel surface into a low surface energy state, increasing the contact angle between the solder paste and the mesh, and significantly reducing adhesion. Simultaneously, the nano-coating fills the microscopic pores on the surface, forming a smooth and dense protective layer, reducing solder paste residue and corrosion.

2. Quantitative Effect of Improved Release Rate

Release rate is a key indicator of stainless steel mesh performance, referring to the proportion of solder paste that completely detaches from the mesh and transfers to the PCB pads. The release rate of traditional uncoated stainless steel mesh is typically between 85% and 92%, fluctuating significantly due to factors such as solder paste viscosity, printing speed, and ambient temperature and humidity. After nano-coating treatment, the release rate can be stably increased to the 95% to 98% range, an improvement of 5% to 10%. This improvement is even more significant in fine-pitch printing; the release rate of components with a pitch of less than 0.3mm can be improved by more than 12%. Improved release rate directly reduces printing defects such as insufficient solder, solder spikes, and bridging, and can reduce soldering failure rate by 30% to 50%. More importantly, the coating reduces the sensitivity of demolding performance to changes in process parameters, widens the printing window, and significantly enhances process stability.

3. Quantitative Effect of Extended Printing Life

Printing life refers to the number of prints a stainless steel mesh can complete while maintaining acceptable printing quality. Traditional stainless steel mesh requires deep cleaning or replacement after 30,000 to 50,000 consecutive prints due to issues such as edge wear, surface scratches, and solder paste buildup. The printing life of nano-coated stainless steel mesh can be extended to 80,000 to 120,000 prints, an increase of 150% to 200%. The core reason for this extended lifespan lies in the coating's wear resistance and anti-adhesion properties. In terms of hardness, the microhardness of the DLC coating can reach 2000 to 4000 HV, far exceeding the 200 to 300 HV of the stainless steel substrate, effectively resisting wear caused by squeegee friction and cleaning wiping. In terms of anti-adhesion, the coating surface energy is as low as 15 to 25 mN/m, solder paste residue is reduced by 60% to 80%, cleaning frequency is extended from once every 500 prints to once every 2000 prints, and downtime is reduced by more than 70%.

The quantitative effects of PCB patch stainless steel mesh nano-coating technology on improving demolding rate and extending print life provide clear data support for SMT process upgrades.
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